Heat transfer due to the impingement of an axisymmetric synthetic jet emanating from a circular orifice: A numerical investigation of a canonical geometry

M. Ebrahim, L. Silva, A. Ortega

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
StatePublished - 2013
Externally publishedYes
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: Jul 16 2013 → Jul 18 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume2

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period7/16/13 → 7/18/13

ASJC Scopus Subject Areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

Access to Document

Other files and links

Cite this