Influence of porosity and film thickness on adhesion of nanoporous organic dielectrics

Andrew V. Kearney; Heitor Chang; Michael E. Mills; Reinhold H. Dauskardt

Influence of porosity and film thickness on adhesion of nanoporous organic dielectrics

Andrew V. Kearney
, Heitor Chang
, Michael E. Mills
, Reinhold H. Dauskardt

Psychological Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Advanced Metallization Conference 2006 (AMC 2006)
Editors	SW Russell, ME Mills, A Osaki, T Yoda
Pages	517-520
Number of pages	4
State	Published - 2007

Cite this

@inproceedings{37b8883e43374bf9a6d7f91778cda841,

title = "Influence of porosity and film thickness on adhesion of nanoporous organic dielectrics",

author = "Kearney, \{Andrew V.\} and Heitor Chang and Mills, \{Michael E.\} and Dauskardt, \{Reinhold H.\}",

year = "2007",

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pages = "517--520",

editor = "SW Russell and ME Mills and A Osaki and T Yoda",

booktitle = "Advanced Metallization Conference 2006 (AMC 2006)",

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AU - Chang, Heitor

AU - Mills, Michael E.

AU - Dauskardt, Reinhold H.

PY - 2007

Y1 - 2007

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M3 - Conference contribution

SP - 517

EP - 520

BT - Advanced Metallization Conference 2006 (AMC 2006)

A2 - Russell, SW

A2 - Mills, ME

A2 - Osaki, A

A2 - Yoda, T

ER -

Influence of porosity and film thickness on adhesion of nanoporous organic dielectrics

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