@article{e2ea5a478e784c17922f297458f8ca82,
title = "Overview of fatigue failure of Pb-Free solder joints in CSP/BGA/Flip-chip applications",
keywords = "BGA, Coffin-Manson, CSP, Damage, Fatigue, Flip-chip, Pb-free, SnAgCu, Solder, Underfill",
author = "Chinen, {Sean M.} and Siniawski, {Matthew T.}",
year = "2009",
doi = "10.4071/1551-4897-6.3.149",
language = "English",
volume = "6",
pages = "149--153",
journal = "Journal of Microelectronics and Electronic Packaging",
issn = "1551-4897",
number = "3",
}