@article{fbbd5cc358a043198f8be0a87f1f4e21,
title = "The attachment of thin alumina ceramic plates to kovar{\textregistered} using gold germanium solder",
keywords = "Defects, Electronic-device failures, Joint failures, Non-destructive inspection, Production failures",
author = "D. Matsuoka and M. Smith and Es-Said, {O. S.}",
year = "1998",
doi = "10.1016/s1350-6307(97)00017-4",
language = "English",
volume = "5",
pages = "69--75",
journal = "Engineering Failure Analysis",
issn = "1350-6307",
publisher = "Elsevier",
number = "1",
}